Groove formed around a semiconductor device on a circuit board



FIG. 1 shows a plan view of the groove formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.

FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 2.

FIG. 5 shows a perspective view of the design in FIG. 1; and,

FIG. 6 shows an enlarged sectional view along the line 4—4 in FIG. 2, on which an environment semiconductor device is disposed.

The broken lines represent unclaimed subject matter. 

The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described. 